specifications and information are subject to change without notice triquint semiconductor, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6633 ? e-mail: info-sales@tqs.com ? web site: www. triquint.com page 1 of 4 april 2009 wja1021 +5v active-bias ingap hbt gain block product features ? 50 ? 4000 mhz ? 17.5 db gain @ 1.9ghz ? +19 dbm p1db @ 1.9ghz ? +37.5 dbm oip3 @ 1.9ghz ? +5v single supply ? low current draw (90ma) ? unconditionally stable ? internally matched to 50 ? robust 1000v esd, class 1c ? lead-free/green/rohs-compliant sot-89 package applications ? gsm, pcs, cdma, wcdma ? wimax, wibro ? repeaters, bts transceivers ? rfid product description the wja1021 is a cascadable ga in block that offers high linearity in a low-cost surface-mount package. at 1.9 ghz, the wja1021 typically provides 17.5 db gain, +37.5 dbm oip3, and +19 dbm p1db. the device is housed in a lead- free/green/rohs-compliant industry-standard sot-89 smt package using a nipdau plating to eliminate the possibility of tin whiskering. the wja1021 consists of darlin gton pair amplifier using a high reliability ingap/gaas hb t process technology. the amplifier has been optimized internally to offer very high linearity performance at 1.9 ghz while drawing very low current. the mmic amplifier is internally matched to 50 ? and only requires dc-blocking capacitors and a bias inductor for operation. an inte rnal active bias is designed to enable stable performance over temperature and allow for operation directly from a +5v supply voltage. the broadband amplifier can be directly applied to various current and next generation wi reless technologies such as gsm, cdma, w-cdma, wibro, and wimax. the wja1021 is ideal for general pu rpose applications such as lo buffering or amplification and pre-driver stages within the 50 to 4000 mhz frequency range. functional diagram rf in gnd rf out gnd 1 23 4 function pin no. input 1 output/bias 3 ground 2, 4 specifications (1) parameter units min typ max operational bandwidth mhz 50 4000 test frequency mhz 1900 gain db 16.1 17.5 19.1 input return loss db -15 output return loss db -10 output p1db dbm +19 output ip3 (2) dbm +34 +37.4 noise figure db 6.3 device voltage v 5 device current ma 80 90.5 100 1. test conditions: 25 oc, supply voltage = +5 v, 50 system. s-parameters and 3oip measured at device pins. all other specificati ons measured on evaluation board. 2. 3oip measured with two tones at an output power of 3 dbm/tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. absolute maximum rating parameter rating storage temperature -55 to +150 c supply voltage +6.5 v thermal resistance, rth 78.8 c / w junction temperature 150 c input power +24 dbm operation of this device above any of th ese parameters may cause permanent damage. typical performance (3) parameter units typical frequency mhz 200 900 1900 2100 s21 db 19.5 18.4 16.7 16.4 s11 db -12 -19 -29 -25 s22 db -20 -13 -10 -10 output p1db dbm +20.2 +20.1 +19 +18 output ip3 (2) dbm +37.8 +39.8 +37.5 +36.9 noise figure db 5.3 5.6 6.3 6.6 3. listed typical performance parame ters measured on evaluation board. ordering information part no. description wja1021 +5v active bias ingap hbt gain block (lead-free/green/rohs-co mpliant sot-89 package) WJA1021-PCB 50 ? 4000 mhz fully assembled eval. board standard tape / reel size = 1000 pieces on a 7? reel
specifications and information are subject to change without notice triquint semiconductor, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6633 ? e-mail: info-sales@tqs.com ? web site: www. triquint.com page 2 of 4 april 2009 wja1021 +5v active-bias ingap hbt gain block typical evaluation board rf performance supply bias = +5v, i cc = 90 ma gain vs. frequency t=25c 0 5 10 15 20 25 0 1000 2000 3000 4000 frequency (mhz) gain ( db ) -40c +25c +85c return loss vs. frequency -35 -30 -25 -20 -15 -10 -5 0 0 1000 2000 3000 4000 frequency (mhz) s11, s22 ( db ) s11 s22 nf vs. frequenc y 0 2 4 6 8 10 0 1000 2000 3000 frequency (m hz) nf ( db ) -40c +25c +85 c oip3 vs. frequency pout=3 dbm/tone 15 20 25 30 35 40 45 0 1000 2000 3000 4000 frequency (mhz) oip3 ( dbm ) +25c -40c +85c p1db vs. frequency 10 12 14 16 18 20 22 0 1000 2000 3000 4000 frequency (mhz) p1db ( dbm ) +25c -40c +25c
specifications and information are subject to change without notice triquint semiconductor, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6633 ? e-mail: info-sales@tqs.com ? web site: www. triquint.com page 3 of 4 april 2009 wja1021 +5v active-bias ingap hbt gain block application circuit c1 blocking capacitor rf out l1 rf choke c3 bypass capacitor r4 0 rf in c2 blocking ca p acito r vcc =+5.00v icc = 90 ma wja1021 for optimal oip3 performance, the ground plan e to the left and right side around the backside paddle of the wja1021 should be r emoved as shown in the above pcb layout. . recommended component values (1) ref. name value / type size l1 470 nh ferrite core wire wound inductor (2) 0805 c1, c2 1000 pf npo chip capacitor 0603 c3 0.018 f chip capacitor 0603 r4 0 (3) 0603 c4, c5, c6, r3, r5, r6, r7, r8 do not place (3) 1. the listed values are contained on the evaluation board to achieve optimal broadband performance 2. for lower cost and performance (500 ? 2000 mhz) option use 39 nh ceramic core wire wound inductor. 3. place holders for the 0 resistors and ?do not place? references are not needed for final design. typical device data s-parameters (v device = +5 v, i cc = 90 ma, t = 25 c, calibrated to device leads) freq (ghz) s11 (db) s11(ang) s21 (db) s21 (ang) s12(db) s12 (ang) s22 (db) s22 (ang) 10 -15.27 -76.97 22.78 168.92 -25.80 14.54 -10.81 -41.48 50 -13.47 -152.73 20.29 167.37 -23.38 5.70 -17.02 -114.67 100 -13.32 -167.56 19.92 167.89 -23.14 2.35 -18.91 -138.72 200 -13.32 -176.11 19.69 162.64 -23.15 -0.19 -19.27 -150.77 400 -12.94 178.15 19.56 149.53 -23.10 -3.54 -19.05 -153.38 600 -12.38 175.26 19.41 135.79 -23.07 -6.98 -18.22 -155.49 800 -12.32 168.40 19.13 122.10 -23.01 -10.41 -16.64 -155.88 1000 -12.56 158.65 18.92 108.57 -22.96 -12.83 -14.40 -155.90 1200 -12.94 146.78 18.58 94.17 -23.04 -16.41 -12.71 -156.76 1400 -12.96 137.52 18.24 81.46 -22.89 -20.13 -11.63 -159.26 1590 -13.24 130.56 17.96 68.23 -22.87 -23.01 -11.35 -165.00 1600 -13.26 130.42 17.95 67.69 -22.87 -22.74 -11.36 -165.60 1800 -14.12 124.89 17.61 54.09 -22.79 -25.91 -11.04 -173.55 2000 -16.59 115.57 17.26 40.63 -22.96 -29.81 -10.18 178.28 2200 -21.32 95.97 16.79 27.03 -22.94 -33.39 -8.81 171.50 2400 -29.00 44.53 16.18 13.53 -23.04 -36.47 -7.80 167.47 2600 -31.47 -55.07 15.66 0.14 -23.06 -39.44 -7.42 162.95 2800 -22.56 -119.27 15.05 -13.34 -23.06 -42.87 -7.44 157.56 3000 -16.22 -137.02 14.35 -27.33 -23.15 -46.10 -7.52 149.16 3200 -12.35 -143.92 13.50 -40.56 -23.27 -49.30 -7.26 140.55 3400 -10.00 -148.38 12.51 -53.24 -23.47 -51.83 -6.61 132.18 3600 -8.71 -155.84 11.58 -65.24 -23.53 -54.62 -5.87 127.43 3800 -7.94 -168.09 10.79 -76.83 -23.40 -57.36 -5.50 124.79 4000 -7.03 175.94 9.72 -89.13 -23.29 -61.41 -5.62 120.23 device s-parameters are available for download from the website at: http://www.wj.com
specifications and information are subject to change without notice triquint semiconductor, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6633 ? e-mail: info-sales@tqs.com ? web site: www. triquint.com page 4 of 4 april 2009 wja1021 +5v active-bias ingap hbt gain block mechanical information this package is lead-free/green/rohs-compliant. it is compatible with bot h lead-free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. the plating material on the leads is nipdau. outline drawing land pattern product marking the wja1021 will be mark ed with an ?a1021? designator with an alphanumeric lot code marked below the part designator. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1c value: passes 1000v min. test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: passes 1000v min. test: charged device model (cdm) standard: jedec standard jesd22-c101 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias ar e critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the boar d contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees. a1021 xxxx-x
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